NPE SHOW A BIG SUCESS!

Dateline June 27, 2003.

2003 National Plastics Exposition
Chicago, Illinois 2003 National Plastics Exposition

Thermoforming Systems LLC (TSL) concluded an extremely successful roll out of its new patent pending Low Flex™ thermoformer frame technology. The Low Flex™ technology allows TSL to accommodate greater loads thereby widening the process window and facilitating the use of advanced forming techniques such as "coining" on a large mold bed thermoformer. The Low Flex™ design concept will be incorporated throughout the entire TSL product line.

The TSL flagship thermoforming system, the Low Flex™ 5.0 was exhibited at NPE. The Low Flex™ 5.0 is capable of operating with a 52" x 52" mold, with a forming pressure in excess of 100 psi, producing a part up to a depth of 9". The entire spectrum of thermoformable materials including polypropylene, APET and polystyrene can be processed on this equipment. The Low Flex™ 5.0 thermoforming system also features other leading edge TSL technologies such as the production proven 3rd Motion™ plug drive system and the user-friendly HMI machine control.

The Version 5.0 HD Trim Press, was also on display, featuring its own new heavier frame design which allows for a significant increase in trim tonnage while accommodating platen strokes up to 14". The press integrates TSL features such as servo pick feed and servo parts eject into the machine design.

For more information about Low Flex™ or other TSL products and services, please contact us via www.tslusa.biz or call Dave Irwin or Roger Moore at 509-454-4578.

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